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Description
Characterized by billion dollar foundry investments, a cyclical market, and intense competition, DRAM manufacturers are faced with enormous challenges. Challenges where even a small percentage shrink in die size can make the difference between success and failure.
The top four vendors (Samsung, Hynix, Micron, and Elpida) continue to leapfrog each other with technology and design improvements. However, we've also seen very impressive innovation from smaller players like Winbond and Powerchip. Innovations that include different methods for building the capacitor to the emerging use of metal gates.
Chipworks' dedicated device acquisition, detailed reports, and depth in DRAM help clients stay on the leading edge of this challenging market.
The top four vendors (Samsung, Hynix, Micron, and Elpida) continue to leapfrog each other with technology and design improvements. However, we've also seen very impressive innovation from smaller players like Winbond and Powerchip. Innovations that include different methods for building the capacitor to the emerging use of metal gates.
Chipworks' dedicated device acquisition, detailed reports, and depth in DRAM help clients stay on the leading edge of this challenging market.
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Dram memory
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